GlobalFoundries Sues TSMC Over Patent Infringement; Apple, Qualcomm, Others Named Defendants
by Anton Shilov on August 26, 2019 12:30 PM EST- Posted in
- Semiconductors
- Apple
- GlobalFoundries
- Qualcomm
- Broadcom
- Cisco
- NVIDIA
- TSMC
GlobalFoundries has filed a lawsuit against TSMC and its clients in the USA and Germany alleging the world’s largest contract maker of semiconductors of infringing 16 of its patents. Among the defendants, GlobalFoundries named numerous fabless developers of chips, including Apple, NVIDIA, Qualcomm, and many others. The plaintiff seeks damages from TSMC and wants courts to ban shipments of products that use semiconductors allegedly infringing its patents into the USA and Germany.
GlobalFoundries says that TSMC infringed 16 of its patents covering various aspects of chip manufacturing (details), including those chips that use FinFET transistors. In particular, the company claims that TSMC’s 7 nm, 10 nm, 12 nm, 16 nm, and 28 nm nodes use its intellectual property. Considering that these manufacturing processes are used to make more than a half of TSMC’s chips (based on revenue share), the potential damages being claimed by GlobalFoundries may reach the billions of dollars.
GlobalFoundries filed complaints in the US International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf, and Mannheim in Germany. In its lawsuits GlobalFoundries demands damages from TSMC and wants courts to bar products that allegedly infringe its rights from being imported into the U.S. and Germany.
Owing to the legal requirement to file claims against the companies who are actually infringing on GlobalFoundries' patents within the United States – TSMC itself is based in Taiwan, so their manufacturing operation is not subject to US jurisdiction – the suit also includes several of TSMC's customers, all of whom import chips into the US that are built using the technology under dispute. Among the big names accused of infringing upon GlobalFoundries' IP are Apple, ASUS, Broadcom, Cisco, Google, NVIDIA, Lenovo, and Motorola. Accordingly, if the courts were to take GlobalFoundries’ side and issue an injunction, such an action would prevent importing a wide swath of tech products, including Apple’s iPhones, NVIDIA GeForce-based graphics cards, smartphones running Qualcomm's SoCs made by TSMC, various routers, as well as devices (e.g., PCs, smartphones) by ASUS and Lenovo containing chips made by TSMC.
| GlobalFoundries vs. TSMC et al | ||||
| Fabless Chip Designers | Consumer Product Manufacturers | Electronic Component Distributors | ||
| Apple Broadcom Mediatek NVIDIA Qualcomm Xilinx |
Arista ASUS BLU Cisco HiSense Lenovo Motorola TCL OnePlus |
Avnet/EBV Digi-key Mouser |
||
GlobalFoundries says that it wants to protect its IP investments in the US and Europe. Here is what Gregg Bartlett, SVP of engineering and technology at GlobalFoundries, had to say:
“While semiconductor manufacturing has continued to shift to Asia, GF has bucked the trend by investing heavily in the American and European semiconductor industries, spending more than $15 billion dollars in the last decade in the U.S. and more than $6 billion in Europe's largest semiconductor manufacturing fabrication facility. These lawsuits are aimed at protecting those investments and the US and European-based innovation that powers them. For years, while we have been devoting billions of dollars to domestic research and development, TSMC has been unlawfully reaping the benefits of our investments. This action is critical to halt Taiwan Semiconductor’s unlawful use of our vital assets and to safeguard the American and European manufacturing base."
| GlobalFoundries vs. TSMC et al, GF's Patents in the Cases | ||||
| Title | Patent No. | Inventors | ||
| Bit Cell With Double Patterned Metal Layer Structures | US 8,823,178 | Juhan Kim, Mahbub Rashed | ||
| Semiconductor device with transistor local interconnects | US 8,581,348 | Mahbub Rashed, Steven Soss, Jongwook Kye, Irene Y. Lin, James Benjamin Gullette, Chinh Nguyen, Jeff Kim, Marc Tarabbia, Yuansheng Ma, Yunfei Deng, Rod Augur, Seung-Hyun Rhee, Scott Johnson, Subramani KengeriSuresh Venkatesan | ||
| Semiconductor device with transistor local interconnects | US 9,355,910 | Mahbub Rashed, Irene Y. Lin, Steven Soss, Jeff Kim, Chinh Nguyen, Marc Tarabbia, Scott Johnson, Subramani Kengeri, Suresh Venkatesan | ||
| Introduction of metal impurity to change workfunction of conductive electrodes | US 7,425,497 | Michael P. Chudzik, Bruce B. Doris, Supratik Guha, Rajarao Jammy, Vijay Narayanan, Vamsi K. Paruchuri, Yun Y. Wang,Keith Kwong Hon Wong | ||
| Semiconductor device having contact layer providing electrical connections | US 8,598,633 | Marc Tarabbia, James B. Gullette, Mahbub RashedDavid S. Doman, Irene Y. Lin, Ingolf Lorenz, Larry Ho, Chinh Nguyen, Jeff Kim, Jongwook Kye, Yuansheng MaYunfei Deng, Rod Augur, Seung-Hyun Rhee, Jason E. Stephens, Scott Johnson, Subramani Kengeri, Suresh Venkatesan | ||
| Method of forming a metal or metal nitride interface layer between silicon nitride and copper | US 6,518,167 | Lu You, Matthew S. Buynoski, Paul R. Besser, Jeremias D. Romero, Pin-Chin, Connie Wang, Minh Q. Tran | ||
| Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | US 8,039,966 | Chih-Chao Yang, Chao-Kun Hu | ||
| Introduction of metal impurity to change workfunction of conductive electrodes | US 7,750,418 | Michael P. Chudzik, Bruce B. Doris, Supratik Guha, Rajarao Jammy, Vijay Narayanan, Vamsi K. Paruchuri, Yun Y. Wang, Keith Kwong Hon Wong | ||
| Methods of forming FinFET devices with a shared gate structure | US 8,936,986 | Andy C. Wei, Dae Geun Yang | ||
| Semiconductor device with stressed fin sections | US 8,912,603 | Scott Luning, Frank Scott Johnson | ||
| Multiple dielectric FinFET structure and method | US 7,378,357 | William F. Clark, Jr., Edward J. Nowak | ||
| Bit cell with double patterned metal layer structures | US 9,105,643 | Juhan Kim, Mahbub Rashed | ||
| Complementary metal oxide semiconductor (CMOS) device having gate structures connected by a metal gate conductor | US 9,082,877 | Yue Liang, Dureseti Chidambarrao, Brian J. Greene, William K. Henson, Unoh Kwon, Shreesh Narasimha, and Xiaojun Yu | ||
| Hybrid contact structure with low aspect ratio contacts in a semiconductor device | DE 102011002769 | Kai Frohberg, Ralf Richter | ||
| Complementary transistors comprising high-k metal gate electrode structures and epitaxially formed semiconductor materials in the drain and source areas | DE 102011004320 | Gunda Beernink, Markus Lenski | ||
| Semiconductor device with transistor local interconnects | DE 102012219375 | Mahbub Rashed, Irene Y. Lin, Steven Soss, Jeff Kim, Chinh Nguyen, Marc Tarabbia, Scott Johnson, Subramani Kengeri, Suresh Venkatesan | ||
Related Reading:
- GlobalFoundries Sells Off Photomask Assets to Toppan
- Marvell to Acquire Avera Semiconductor from GlobalFoundries
- GlobalFoundries to Sell 300mm New York Fab to ON Semiconductor
- GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business
- AMD Amends Wafer Supply Agreement with GlobalFoundries: 7nm Freed, 12nm+ Targets Set Through 2021
- GlobalFoundries and Chinese Authorities Reconsider Plans
- GlobalFoundries Stops All 7nm Development: Opts To Focus on Specialized Processes
Source: GlobalFoundries
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patel21 - Monday, August 26, 2019 - link
I would really love Apple buying out GoFlo and kickstarting their 7nm and further technologies.melgross - Tuesday, August 27, 2019 - link
Cases like this should just be thrown out. If TSMC was using their patents way back with 28nm, it’s impossible to believe that GF wasn't aware of it then. Considering that, why did they wait through 22nm, 18nm, 16nm, 14nm, 12nm, 10nm, and now, finally, 7nm?They should have to provide evidence that they didn’t know of this back then. Otherwise, it’s just a typical troll tactic. Sit back and wait until a company becomes reliant upon something before suing. That way, they have no choice but to make a huge payout, because they can’t back out of what they’re doing, which they could have in the beginning.
And they’re saying that no other chip manufacturer (Intel, obviously) uses any of these patents? Nuts!
HStewart - Wednesday, August 28, 2019 - link
I knew someone would blindly blame Intel here - Intel has nothing to do with GoFlo /TSMC Lawsuit.Korguz - Wednesday, August 28, 2019 - link
and i knew you would defend intel, when no defense was needed. but your intel blindness, prevents you from seeing the possibility, that intel could be using some of these patents as well.mikato - Wednesday, August 28, 2019 - link
As other comments have said, it's possible they didn't act previously because it would have affected their own customers negatively and they weighed the tradeoffs in favor of not acting. Now the equation is different. I have no idea regarding when a company needs to take this action if they know some infringement is taking place and whether or not waiting until the other company develops reliance or something would invalidate a claim.Maxiking - Tuesday, August 27, 2019 - link
It is a scam like every AMD have touched.https://www.reddit.com/r/pcgaming/comments/cusn2t/...
sa666666 - Thursday, August 29, 2019 - link
Why don't you, Phynaz and HStewart get a room? That is, unless you're not already just split personalities of the same obvious troll.Bob Dean - Tuesday, August 27, 2019 - link
It seems that these patents are regarding the manufacturing process...AnakinG - Tuesday, August 27, 2019 - link
I wonder how much reverse engineering GF had to do to make a case for this thing... It's so hard to prove "infringement" on process.rocketbuddha - Tuesday, August 27, 2019 - link
The problem is that the Power Point Foundry specialists which grew by chewing multiple Fab companies. The latest casualty being IBM micro electronics.With AMD moving to TSMC for the "best" process node as GF is stuck with 12nm for the near future and whatever "special" foundry work, atleast AMD is throwing them a bone by making the current XBOX and PS4 chips as well as IO dies for the Ryzen 3 and Rome processors. If Gonzolo and Scarlett are going to be fabbed at < 12nm then there goes future orders from MS and Sony.
I think the kick to the b**ls was when IBM decided to go with Samsung for their future POWER processors rather than with GF to whom it sold its fabs in 2015 years back...It sold its 14nm FD-SOI and now has decided to work with Samsung on 7nm FinFET for future processors leaving GF with no big customers of their own but heavy infrastructure of Fabs..
So they have to find ways to get the cash register running and why not suing ;-)