CPUs

As part of SiFive’s announcements today, along with enabling SiFive IP on Intel’s Foundry Service offerings, Intel will be creating its own RISC-V development platform using its 7nm process technology. This platform, called Horse Creek, will feature several of SiFive’s new Performance P550 cores also being announced today, and will be paired with Intel’s DDR and PCIe IP technology.

TSMC Launches New N12e Process: FinFET at 0.4V for IoT

One of the main drivers for the semiconductor industry is the growth in always-connected devices that require silicon inside, either for compute, communication, or control. The ‘Internet of Things&rsquo...

27 by Dr. Ian Cutress on 8/27/2020

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

32 by Dr. Ian Cutress on 8/27/2020

Where are my GAA-FETs? TSMC to Stay with FinFET for 3nm

As we passed that 22nm to 16nm barrier, almost all the major semiconductor fabrication companies on the leading edge transitioned from planar transistors to FinFET transistors. The benefits of...

37 by Dr. Ian Cutress on 8/26/2020

TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)

One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes...

13 by Dr. Ian Cutress on 8/25/2020

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies...

16 by Dr. Ian Cutress on 8/25/2020

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...

4 by Dr. Ian Cutress on 8/25/2020

‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5

One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...

107 by Dr. Ian Cutress on 8/25/2020

Intel Moving to Chiplets: ‘Client 2.0’ for 7nm

One of the more esoteric elements of Intel’s Architecture Day 2020 came very near the end, where Intel spent a few minutes discussing what it believes is the future...

67 by Dr. Ian Cutress on 8/21/2020

Cerebras Wafer Scale Engine News: DoE Supercomputer Gets 400,000 AI Cores

One of the more interesting AI silicon projects over the last couple of years has been the Cerebras Wafer Scale Engine, most notably for the fact that a single...

8 by Dr. Ian Cutress on 8/21/2020

342 Transistors for Every Person In the World: Cerebras 2nd Gen Wafer Scale Engine Teased

One of the highlights of Hot Chips from 2019 was the startup Cerebras showcasing its product – a large ‘wafer-scale’ AI chip that was literally the size of a...

32 by Dr. Ian Cutress on 8/18/2020

Hot Chips 2020 Live Blog: Microsoft Xbox Series X System Architecture (6:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

59 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Alibaba Xuantie-910 RISC-V CPU (3:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

6 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Intel's Raja Koduri Keynote (2:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

19 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020: Marvell Details ThunderX3 CPUs - Up to 60 Cores Per Die, 96 Dual-Die in 2021

Today as part of HotChips 2020 we saw Marvell finally reveal some details on the microarchitecture of their new ThunderX3 server CPUs and core microarchitectures. The company had announced...

27 by Andrei Frumusanu on 8/17/2020

Hot Chips 2020 Live Blog: Intel's Tiger Lake Mobile CPU (12:30pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

42 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: AMD Ryzen 4000 APU (Noon PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

15 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: IBM z15, a 5.2 GHz Mainframe CPU (11:00am PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

21 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Marvell ThunderX3 (10:30am PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

6 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: IBM's POWER10 Processor on Samsung 7nm (10:00am PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

17 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Next Gen Intel Xeon, Ice Lake-SP (9:30am PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

26 by Dr. Ian Cutress on 8/17/2020

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